In the 5G era, base station heat dissipation is a significant technological issue. High temperatures reduce chip frequency and signal coverage while increasing operating and maintenance expenses. Heat dissipation is the most pressing issue for 78% of global operators when it comes to 5G rollout. More than 60% of electronic equipment failures are due to heat dissipation failure. Traditional pure copper solutions are heavy and expensive, but 6063 aluminum plates are changing the heat dissipation laws of 5G base stations with their golden triangle performance of "lightweight + super thermal conductivity + corrosion resistance".
Why use a 6063 aluminum plate?
1. Choose an exclusive heat dissipation model and condition.
High-power chip heat dissipation using a 3.0 mm T6 aluminum plate and micro-arc oxidation (breakdown voltage > 3000 V).
Lightweight mobile devices use a 1.5 mm T6 aluminum plate with nano-coating (50% lighter than copper).
| Alloy | 6063-T6 (optimal strength/thermal conductivity balance) |
| Thickness | 1.0 mm-3.0 mm |
| Surface treatment | Anodizing (film thickness 10-15 μm) |
| Thermal conductivity | 200 W/(m·K) |
| Flatness tolerance | ≤0.15 mm/m |
2. Performance advantages
| Index | 6063-T6 aluminum plate | Pure copper plate | Carbon steel nickel plate |
| Thermal conductivity | 200 W/(m·K) | 398 W/(m·K) | 50 W/(m·K) |
| Cost/unit thermal conductivity | $0.25 | $1.98 | $0.80 |
| Salt spray resistance time | ＞2000 hours | ＜500 hours | 1200 hours |
| Processability | Stamping/etching/welding | Machining only | Limit welding |
Application of 6063 aluminum plate in the 5G base station.
The cost of Huawei's 5G base station heat sink has lowered by 40%.
The heat dissipation criteria for Huawei AAU equipment are 200W power consumption and a temperature rise of less than 35℃. The first approach involved using 2mm copper plate, which weighed 1.2 kg and cost $45 per piece.
Solution:
Replaced with 2.5mm 6063-T6 aluminum plate with fin stamping pattern and black anodizing.
Added a graphene thermal pad (interface thermal resistance decreased by 60%).
Results:
◆ Radiator weight decreased to 0.7kg (42% reduction)
◆ Chip temperature decreased from 98℃ to 78℃, below the safety level.
◆ Annual procurement savings surpass $700,000, with a unit cost of just $27.
